RtoR copper sulfate plating additive "US-01"
It is possible to keep internal stress low! The stability of the bath is high, and liquid management is easy.
"US-01" is a copper sulfate plating additive for flexible printed circuit boards. The deposited film is highly ductile and has excellent thermal shock resistance, allowing for lower internal stress compared to conventional additives. Additionally, it has high bath stability and easy liquid management. [Components] ■ Copper sulfate CuSO4·5H2O (g/L) ■ Sulfuric acid H2SO4 (G/L) ■ Chloride ion Cl- (ppm) ■ US-MU (mL/L) ■ US-01 (mL/L) *For more details, please refer to the PDF document or feel free to contact us.
- Company：プライム・テクノロジー
- Price：Other
